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2019 2nd International Conference on Electronics and Signal Processing (ICESP 2019)

Date :

Place : Hong Kong S.A.R., Yuen Long Kau Hui

Website :

Contact Person:Jennifer Zeng

Description:

For papers submitted to ICESP 2019, we offer the publication as following: 1. Publication in IJSPS. Submissions will be peer reviewed by both the conference scientific committees and journal editorial board, and accepted papers will be published in International Journal of Signal Processing Systems,(issn: 2315-4535; doi: 10.18178/ijsps) which will be indexed by Ulrich's Periodicals Directory, Google Scholar, Crossref, etc. 2. Publication in IJEETC. Submissions will be peer reviewed by both the conference scientific committees and journal editorial board, and accepted papers will be published in International Journal of Electrical and Electronic Engineering & Telecommunications (issn:2319-2518; doi: 10.18178/ijeetc), which will be indexed by Scopus, Google Scholar, Crossref, Citefactor, etc. 3. Publication in JCM. Submissions will be peer reviewed by both the conference scientific committees and journal editorial board, and accepted papers will be published in Journal of Communications (issn: 1793-8163; doi: 10.12720/jcm), which will be indexed by Scopus; DBLP; ULRICH's Periodicals Directory; Inspec, etc.

2019 2nd International Conference on Electronics and Signal Processing (ICESP 2019) will be held in Yuen Long Kau Hui,Hong Kong S.A.R. on date 2019-08-28

Deadline for abstracts/proposals : 10th April 2019

Organized By :ICESP 2019

Keynote Speakers : Prof. Dong Hwa Kim, Department of Instrumentation and Control Engineering, Hanbat National University, South Korea; Prof. Yin-Tien Wang, Department of Mechanical Engineering, Tamkang University, Taiwan;

Conference Highlights :Conference Co-chairs: Prof. Dong Hwa Kim, Department of Instrumentation and Control Engineering, Hanbat National University, South Korea; Prof. Sim Kok Swee, The Multimedia University, Malaysia; Technical Program Chair: Prof. Yin-Tien Wang, Department of Mechanical Engineering, Tamkang University, Taiwan; Prof. Goh Bean San, Department of Electrical & Computer Engineering, Curtin University, Sarawak, Malaysia;

Venue :Hong Kong

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