Place : India, Jaipur
Contact Person:Umamaheswara Rao Tida
Description:CALL FOR PAPERS: IEEE-iSES 2021 - DEADLINE: June 28, 2021 7th IEEE INTERNATIONAL SYMPOSIUM ON SMART ELECTRONIC SYSTEMS December 20-22, 2021, Jaipur, India www.ieee-ises.org Join IEEE-iSES LinkedIn Group https://www.linkedin.com/groups/12506886 The primary objective of IEEE-iSES is to provide a platform for both hardware and software researchers to interact under one umbrella for further development of smart electronic systems. Symposium addresses key technologies and enabling technologies for Smart Systems as well as solutions for Energy, agriculture, health, biomedical, industry, housing, sustainability, social cohesion and mobility. The smart systems entail architectures, systems software and algorithms as key technologies. Nonetheless, other technologies such as internet, data analytics, security, cognitive science join as enabling technologies. Smart systems adapt to changing conditions such as context, application and may possess own awareness and cater to the needs of efficient sensing, storage, software and computing. Big data which are large, complex data sets, are now a part of the Internet world. Storing and processing needs of the enormous amount of structured and unstructured data are getting increasingly challenging. At the same time, Internet of Things (IoT) and cyber-physical systems (CPS) have been evolving with simultaneous development of hardware and software and span across everyday consumer electronics. The performance and efficiency of the various generations of computing and information processing systems are dependent upon advances in both hardware and software. IEEE-iSES is a sponsored meeting of Technical Committee on VLSI, IEEE-CS that endorses a league of successful meetings including ASAP, ISVLSI, and ARITH, are now presented as “Sister Conferences”. CONTRIBUTIONS ARE SOUGHT IN THE FOLLOWING AREAS : --------------------------------------------------- Nanoelectronic VLSI and Sensor Systems (NVS) Energy-Efficient, Reliable VLSI Systems (ERS) Hardware/Software for Internet of Things and Consumer Electronics (IoT) Hardware for Secure Information Processing (SIP) Hardware/Software Solutions for Big Data (SBD) Cyber Physical Systems and Social Networks (CSN) IEEE-iSES technical program will include both contributed papers and contributions from invited speakers. IEEE-iSES 2021 will have pre-conference tutorials, keynotes, planery talks, tutorials, technical sessions, special sessions, expert panels, a research demo session, and a student research forum. Several student travel and best paper awards will be available just like each year. PAPER SUBMISSION DEADLINES: ----------------------------- Submission : June 28, 2021 Acceptance : September 15, 2021 Final Version: September 30, 2021 IEEE-iSES proceedings will be published by IEEE-CS conference publications services (CPS). Authors should submit their original unpublished work of maximum 6 pages using IEEE-CS double-column conference format-template. Manuscripts in PDF format with author information (optional) should be submitted using the link: https://edas.info/N28177. Selected papers from IEEE-iSES 2021 program will be invited for submission to special issues of peer-reviewed journals as has been done in the past. Special Sessions and Panels (SSP): iSES 2021 will consider proposals for special sessions as well as panels. Special session and panel proposals/papers can be submitted to “Special Sessions and Panels” track at the online submission link.The submission deadline is the same as specified for the regular paper submissions. All accepted special session papers will be published in the conference proceedings. Student Research Forum (SRF): iSES 2021 will host a student research forum. Authors should submit their original unpublished work of maximum 4 pages (short paper) using IEEE-CS double-column conference format-template. Manuscripts in
Deadline for abstracts/proposals : 28th June 2021
Organized By :IEEE-iSES technical program
Keynote Speakers :
Check the event website for more details.