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The 6th International Conference on Mechanical and Electronics Engineering (ICMEE 2020)
Date :
Place : Japan, Osaka
Website :http://icmee.org
Contact Person:Ms. Serene Lo
Description:
Accepted papers can be published in ICMEE proceedings and made available through IEEE Xplore. Proceedings will be submitted for inclusion in leading indexing services, includingThe 6th International Conference on Mechanical and Electronics Engineering (ICMEE 2020) will be held in Osaka,Japan on date 2020-05-12
Deadline for abstracts/proposals : 20th March 2020
Organized By :ICMEE 2020
Keynote Speakers : Prof. John Mo, (Fellow of IME and IEA), Royal Melbourne Institute of Technology, Australia; Prof. Shih-Chieh Lin, (President of ISME), National Tsing-Hua University, Taiwan; Prof. JING Xingjian, The Hong Kong Polytechnic University, Hong Kong
Conference Highlights :ICMEE 2020 is the premier forum for the presentation of new advances and research results in the fields of theoretical, experimental, and applied Mechanical and Electronics Engineering. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world.
Venue :Osaka Convention Center, Osaka, Japan
Check the event website for more details.
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