Conference Details

Harnessing active and intelligent technologies to add value to flexible and rigid packaging.

Date :

Place : Germany, Cologne

Website :

Contact Person:Emily Renshaw

Description:

Harnessing active and intelligent technologies to add value to flexible and rigid packaging.

Harnessing active and intelligent technologies to add value to flexible and rigid packaging. will be held in Cologne,Germany on date 2017-09-20

Deadline for abstracts/proposals : 9th August 2016

Organized By :Applied Market Information

Keynote Speakers :

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